Apparatuses and methods for decoding addresses for memory

ABSTRACT

Apparatuses and methods for decoding addresses for memory are disclosed. An example apparatus includes a memory cell array and a row decoder. The memory cell array includes a bank of memory including a plurality of groups of memory. Each of the groups of memory includes sections of memory, and each of the sections of memory including memory cells arranged in rows and columns of memory. The row decoder decodes addresses to access a first group of memory to include rows of prime memory from a first block of memory and to include rows of prime memory from a second block of memory. The row decoder decodes the addresses to access a second group of memory to include rows of prime memory from the second block of memory and to include rows of redundant memory. The rows of redundant memory are shared with the first and second blocks of memory.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/249,714, filed Jan. 16, 2019 and issued as U.S. Pat. No. 11,031,083on Jun. 8, 2021. The aforementioned application, and issued patent, areincorporated by reference herein in their entirety and for all purposes.

BACKGROUND

Semiconductor memory are used in many electronic systems to store data.An example of semiconductor memory is dynamic random access memory(DRAM). Semiconductor memories include a memory array having memorycells in which the data may be stored. The memory cells are typicallyorganized and accessed as rows and columns of memory cells, with eachmemory cell associated with an intersection of a row and column. Memorycells are accessed by decoding memory addresses which are received bythe memory and decoded by decoder circuits included in the memory.

The decoder circuits decode the memory addresses and access the memorycells according to a physical arrangement of the memory array. Memoryarrays are typically arranged to facilitate binary address decoding,with banks and sections of memory cells laid out along binary numbers ofrows and columns. Additionally, the memory arrays may be arranged tofacilitate other operations of the memory. For example, the arrangementof memory arrays may facilitate testing of the memory array, memory cellrefresh operations needed to maintain data integrity, accessingredundant memory used to repair defective memory cells, as well as otheroperations.

Arranging memory arrays to facilitate binary address decoding, however,limits flexibility when designing the memory array. For example,limiting banks and/or sections of memory to include binary numbers ofrows and/or columns of memory may result in a physical arrangement thatproduces poor layout area efficiency or compromises performance (e.g.,slower memory cell access time, relatively higher power consumption,etc.) due to electrical characteristics inherent in the semiconductorstructures of the memory array, such impedance of conductive lines ofthe memory array.

Thus, it may be desirable to provide memory address decoding that allowsfor flexible arrangements of banks and/or sections of memory arrays andmay facilitate operations of the memory.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a semiconductor device accordingto an embodiment of the disclosure.

FIG. 2 is a block diagram of a bank of memory according to an embodimentof the disclosure.

FIG. 3 is a block diagram of sections of memory included in a group ofmemory sections according to an embodiment of the disclosure.

FIG. 4 is a block diagram of sections of memory included in a group ofmemory sections according to an embodiment of the disclosure.

FIG. 5 is a block diagram of a bank of memory according to an embodimentof the disclosure.

DETAILED DESCRIPTION

Various embodiments of the present disclosure will be explained below indetail with reference to the accompanying drawings. The followingdetailed description refers to the accompanying drawings that show, byway of illustration, specific aspects and embodiments of the disclosure.The detailed description includes sufficient detail to enable thoseskilled in the art to practice the embodiments of the disclosure. Otherembodiments may be utilized, and structural, logical and electricalchanges may be made without departing from the scope of the presentdisclosure. The various embodiments disclosed herein are not necessarymutually exclusive, as some disclosed embodiments can be combined withone or more other disclosed embodiments to form new embodiments.

FIG. 1 is a schematic block diagram of a semiconductor device 100, inaccordance with an embodiment of the present disclosure. Thesemiconductor device 100 may include a clock input circuit 105, aninternal clock generator 107, an address command input circuit 115, anaddress decoder 120, a command decoder 125, a plurality of row (e.g.,first access line) decoders 130, a memory cell array 145 including senseamplifiers 150 and transfer gates 195, a plurality of column (e.g.,second access line) decoders 140, a plurality of read/write amplifiers165, an input/output (I/O) circuit 170, and a voltage generator 190. Thesemiconductor device 100 may include a plurality of external terminalsincluding address and command terminals coupled to command/address bus,clock terminals CK and/CK, data terminals DQ, DQS, and DM, and powersupply terminals VDD, VSS, and VDDQ. The terminals and signal linesassociated with the command/address bus may include a first set ofterminals and signal lines that are configured to receive the commandsignals and a separate, second set of terminals and signal lines thatconfigured to receive the address signals, in some examples. In otherexamples, the terminals and signal lines associated with the command andaddress bus may include common terminals and signal lines that areconfigured to receive both command signal and address signals. Thesemiconductor device may be mounted on a substrate, for example, amemory module substrate, a motherboard or the like.

The memory cell array 145 includes a plurality of banks of memoryBANK0-N, where N is a positive integer, such as 3, 7, 15, 31, etc. Eachbank of memory BANK0-N may include a plurality of word lines WL, aplurality of digit lines DL, and a plurality of memory cells MC arrangedat intersections of the plurality of word lines WL and the plurality ofdigit lines DL. The plurality of memory cells are arranged in rows ofmemory corresponding to the plurality of word lines and in columns ofmemory corresponding to the digit lines. The selection of the word lineWL for each bank of memory BANK0-N is performed by a corresponding rowdecoder 130 and the selection of the digit line DL is performed by acorresponding column decoder 140. The plurality of sense amplifiers 150are located for their corresponding digit lines DL and coupled to atleast one respective local I/O line further coupled to a respective oneof at least two main I/O line pairs, via transfer gates TG 195, whichfunction as switches. The sense amplifiers 150 and transfer gates TG 195may be operated based on control signals from decoder circuitry, whichmay include the address decoder 120, the row decoders 130, the columndecoders 140, any control circuitry of the memory cell array 145 of thebanks of memory BANK0-N, or any combination thereof. In some examples,the tRCD for the semiconductor device 100 may involve operations of therow decoders 130, the column decoders 140, and circuitry of the memorycells array 145 of each of the plurality of banks of memory BANK0-N(e.g., including the plurality of sense amplifiers 150 and the transfergates TG 195).

In some examples, the plurality of sense amplifiers 150 may includethreshold voltage compensation circuitry that compensates for thresholdvoltage differences between components of the sense amplifiers 150.Compensating for threshold voltage Vt differences between circuitcomponents within the sense amplifier 150 may mitigate effects of smallvariances in the performance between circuit components of the senseamplifiers 150 (e.g., due to process, voltage, and temperature (PVT)variance) and improve reliability.

The command/address input circuit 115 may receive an address signal anda bank address signal from outside at the command/address terminals viathe command/address bus and transmit the address signal and the bankaddress signal to the address decoder 120. The address decoder 120 maydecode the address signal received from the address/command inputcircuit 115 and provide a row address signal XADD to the row decoder130, and a column address signal YADD to the column decoder 140.

The command/address input circuit 115 may receive a command signal fromoutside, such as, for example, a memory controller at thecommand/address terminals via the command/address bus and provide thecommand signal to the command decoder 125. The command decoder 125 maydecode the command signal and generate various internal command signals.The internal command signals may be used to control operation and timingof various circuits of the semiconductor device 100. For example, theinternal command signals may include row and column command signals tocontrol circuits to perform access operations to selected word lines anddigit lines, such as a read command or a write command.

Accordingly, when a row activation command is issued and a bank addressand row address are timely supplied with the activation command, and acolumn address is timely supplied with a read command, read data is readfrom a memory cell in the memory cell array 145 designated by the rowaddress and the column address.

The read/write amplifiers 165 may receive the read data DQ and providethe read data DQ to the IO circuit 170. The IO circuit 170 may providethe read data DQ to outside via the data terminals DQ, DQS and DMtogether with a data strobe signal at DQS and a data mask signal at DM.Similarly, when the row activation command is issued and a bank addressand row address are timely supplied with the activation command, and acolumn address is timely supplied with a write command, the input/outputcircuit 170 may receive write data at the data terminals DQ, DQS, DM,together with a data strobe signal at DQS and a data mask signal at DMand provide the write data via the read/write amplifiers 165 to thememory cell array 145. Thus, the write data may be written in the memorycell designated by the row address and the column address.

To help ensure the reliability of the semiconductor device 100, memorycells of the memory cell array 145 are tested to detect defective cells.Typically, to repair a row or column of memory (e.g., row or column ofprime memory), the memory cell array 145 may include rows and columns ofredundant memory that can be swapped for a defective row or column ofmemory, respectively. In order to maintain which rows or columns havebeen replaced, the semiconductor device 100 may include the redundantaddress circuit 155.

The redundant address circuit 155 may include circuitry that isconfigured to store row addresses and column addresses that correspondto rows or columns of prime memory that have been determined to bedefective. The redundant address circuit 155 may also include circuitrythat compares the row address XADD with stored defective row addresses(e.g., and/or compares the column address YADD with stored defectivecolumn addresses) to detect a match. The redundant address circuit 155may provide an active XMATCH signal to the row decoder 130 in responseto detecting that a memory rows associated with the row address XADD isdefective based on the comparison and may provide an active YMATCH tothe column decoder 140 in response to detecting that a memory columnassociated with the column address YADD is defective based on thecomparison.

In response to the active XMATCH signal, the row decoder 130 mayredirect the row address XADD to a replacement row address associatedwith a row of redundant memory in the memory cell array 145 whenperforming previously discussed operations. Similarly, in response tothe active YMATCH signal, the column decoder 140 may redirect the columnaddress YADD to a replacement column address associated with a column ofredundant memory in the memory cell array 145 when performing previouslydiscussed operations.

Turning to the explanation of the external terminals included in thesemiconductor device 100, the clock terminals CK and/CK may receive anexternal clock signal and a complementary external clock signal,respectively. The external clock signals (including complementaryexternal clock signal) may be supplied to a clock input circuit 105. Theclock input circuit 105 may receive the external clock signals andgenerate an internal clock signal ICLK. The clock input circuit 105 mayprovide the internal clock signal ICLK to an internal clock generator107. The internal clock generator 107 may generate a phase controlledinternal clock signal LCLK based on the received internal clock signalICLK and a clock enable signal CKE from the address/command inputcircuit 115. Although not limited thereto, a DLL circuit may be used asthe internal clock generator 107. The internal clock generator 107 mayprovide the phase controlled internal clock signal LCLK to the IOcircuit 170. The IO circuit 170 may use the phase controller internalclock signal LCLK as a timing signal for determining an output timing ofread data.

The power supply terminals may receive power supply voltages VDD andVSS.

These power supply voltages VDD and VSS may be supplied to a voltagegenerator circuit 190. The voltage generator circuit 190 may generatevarious internal voltages, VCCP, VOD, VBLP, NSA_BIAS, VARY, VPERI, andthe like based on the power supply voltages VDD and VSS. The internalvoltage VCCP is mainly used in the row decoder 130, the internalvoltages VOD, VBLP, NSA_BIAS, and VARY are mainly used in the senseamplifiers 150 included in the memory cell array 145, and the internalvoltage VPERI is used in many other circuit blocks. The IO circuit 170may receive the power supply voltages VDD and VSS.

For example, the power supply voltages VDDQ and VSS may be the samevoltages as the power supply voltages VDD and VSS, respectively.However, the dedicated power supply voltages VDDQ and VSS may be usedfor the IO circuit 170.

FIG. 2 is a block diagram of a bank of memory 200 according to anembodiment of the disclosure. The bank of memory 200 may be included inthe banks of memory of memory cell array 145 of FIG. 1 , in someembodiments of the disclosure.

The bank of memory 200 includes memory cells which are arranged in rowsand columns of memory with a memory cell at the intersection of a rowand column. The rows and columns of memory are included in severalsections of memory. The sections of memory may be grouped into groups ofmultiple sections of memory. Each of the sections may include the samenumber of rows and columns of memory in some embodiments of thedisclosure. In some embodiments of the disclosure, a section of memorymay include a different number of rows and/or columns of memory.

In the example shown in FIG. 2 , the bank of memory 200 includes 48sections of memory, which are grouped into 16 groups of 3 sections. Thegroups of the bank of memory 200 are referenced as Groups 0-15, witheach Group including Sections 0-2.

In some embodiments of the disclosure, each of the Sections includes anon-binary number of rows of memory. A non-binary number is a numberthat is other than a base-2 number. Examples of base-2 numbers are 1, 2,4, 8, 16, 32, 64, . . . , etc. As known, binary numbers facilitatedecoding of addresses to corresponding memory locations. In the exampleshown in FIG. 2 , it is assumed that each of the Sections includes 1,376rows of memory. As a result, each Group includes 4,128 rows of memory,and the bank of memory 200 includes 66,048 rows of memory.

The rows of memory of the banks of memory are decoded by row decoder210. The row decoder 210 may be included in the row decoder 130 of FIG.1 , in some embodiments of the disclosure. Logic circuits of the rowdecoder 210 decode internal addresses to selectively activate a row orrows of memory corresponding to an address to be accessed (e.g., readoperation, write operation, etc.). For example, row decoder 210 maydecode a portion (or portions) of the address bits of an internal rowaddress to identify a row for activation. Sense amplifiers are includedin the regions between the Sections and are shown in FIG. 2 incrosshatch. The sense amplifiers may have an open digit linearchitecture in some embodiments of the disclosure. For example, whereeach of the sense amplifiers is coupled to a first digit line thatextends into one section of memory and is coupled to a second digit linethat extends into an adjacent section of memory. The digit lines maygenerally correspond to a column of memory of the sections of memory.When accessing any of the rows of memory in the sections of memory intowhich the digit lines extend, the sense amplifiers coupled to the digitlines are activated.

At least one of the Groups includes rows of memory that are decoded(e.g., accessed) by the row decoder 210 as associated with a pluralityof different blocks of memory. For example, in some embodiments of thedisclosure, a Group includes rows of memory that are decoded asassociated with a block of memory, and also includes rows of memory thatare decoded as associated with another block of memory. The row decoder210 decodes addresses to access the Group(s) to include rows of memoryfrom more than one block of memory. Additionally, every Group does notinclude rows of memory that are decoded as rows of redundant memory. Forexample, in some embodiments of the disclosure, rows of memory that aredecoded as rows of redundant memory for the bank of memory 200 areincluded in one of the Groups and the row decoder 210 accesses the rowsof redundant memory accordingly. In some embodiments of the disclosure,the rows of redundant memory for the bank of memory 200 are included inone of the Sections. The rows of redundant memory may be used to repairdefective rows of memory of the bank of memory 200 as previouslydescribed.

FIG. 3 is a block diagram of sections of memory included in a group ofmemory sections Group 300 according to an embodiment of the disclosure.The group of memory sections Group 300 may be included in the bank ofmemory 200 of FIG. 2 and/or in the bank of memory 200 of FIG. 2 in someembodiments of the disclosure.

The Group 300 includes three sections of memory: Section 0, Section 1,and Section 2 (sense amplifiers used by Sections 0, 1, and 2 are omittedfrom FIG. 3 ). A portion of a row decoder 310 is also shown in FIG. 3 .The row decoder 310 decodes internal addresses to selectively activate arow or rows of memory corresponding to an address to be accessed (e.g.,read operation, write operation, etc.). The row decoder 310 may beincluded in the row decoder 130 of FIG. 1 and/or included in the rowdecoder 210 of FIG. 2 , in some embodiments of the disclosure. Senseamplifiers are included in regions between Section 0 and Section 1, andbetween Section 1 and Section 2 (not shown in FIG. 3 ). Sense amplifiersmay also be included in a region adjacent Section 0 that is opposite ofSection 1. Sense amplifiers may be included in a region adjacent Section2 that is opposite of Section 1.

Each of the Sections includes a non-binary number of rows of memory.Additionally, the Group 300 does not include any rows of memory that aredecoded by the row decoder 310 as rows of redundant memory. However, theGroup 300 includes rows of memory that are decoded as associated with aplurality of different blocks of memory. The row decoder 310 decodes theinternal addresses to access the rows of memory of Group 300 asincluding rows of memory associated with the different blocks of memory.

In the example of FIG. 3 , each of the Sections includes 1,376 rows ofmemory. As a result, the Group 300 includes 4,128 rows of memory. All ofthe 4,128 rows of memory are decoded as rows of prime memory. The Group300 includes rows of memory that may be decoded as associated with afirst block of memory, and rows of memory that may be decoded asassociated with a second block of memory (not shown). In someembodiments of the disclosure, a binary number of rows of memory of theGroup are associated with the first block of memory and a binary numberof rows of memory of the Group are associated with the second block ofmemory. For example, the 4,128 rows of memory of Group 300 may bedecoded by the row decoder 310 as 4,096 rows of memory 320 (4K rows ofmemory) associated with the first block of memory, and as 32 rows ofmemory 330 associated with a second block of memory. The row decoder 310includes logic circuits to decode internal addresses to access the rowsof memory accordingly. The rows of memory associated with the secondblock of memory are included in one Section of Group 300. In theparticular example of FIG. 3 , the 32 rows of memory associated with thesecond block of memory are included in Section 2. The 4,096 rows ofmemory associated with the first block of memory are included in Section0, Section 1, and a portion of Section 2.

FIG. 4 is a block diagram of sections of memory included in a group ofmemory sections Group 400 according to an embodiment of the disclosure.The group of memory sections Group 400 may be included in the bank ofmemory 200 of FIG. 2 and/or in the bank of memory 200 of FIG. 2 in someembodiments of the disclosure.

The Group 400 includes three sections of memory: Section 0, Section 1,and Section 2 (sense amplifiers used by Sections 0, 1, and 2 are omittedfrom FIG. 4 ). A portion of a row decoder 410 is also shown in FIG. 4 .The row decoder 410 decodes internal addresses to selectively activate arow or rows of memory corresponding to an address to be accessed (e.g.,read operation, write operation, etc.). The row decoder 410 may beincluded in the row decoder 130 of FIG. 1 and/or included in the rowdecoder 210 of FIG. 2 , in some embodiments of the disclosure. Senseamplifiers are included in regions between Section 0 and Section 1, andbetween Section 1 and Section 2 (not shown in FIG. 3 ). Sense amplifiersmay be included in a region adjacent Section 0 that is opposite ofSection 1. Sense amplifiers may be included in a region adjacent Section2 that is opposite of Section 1.

Each of the Sections includes a non-binary number of rows of memory.Additionally, the Group 400 includes rows of redundant memory. The Group400 includes rows of memory associated with at least one block ofmemory. The row decoder 410 decodes the internal addresses to access therows of memory of Group 400 as including rows of memory associated withat least one block of memory.

In the example of FIG. 4 , each of the Sections includes 1,376 rows ofmemory. As a result, the Group 400 includes 4,128 rows of memory. The4,128 rows of memory may be decoded by the row decoder 410 as 3,584 rowsof prime memory 420 and 430, and 512 rows of redundant memory 440. The512 rows of redundant memory 440 may be used to repair defective rows ofmemory of a bank of memory that includes the Group 400. The Group 400includes rows of (prime) memory that may be decoded as associated with ablock of memory. For example, the rows of memory of Group 400 may bedecoded as 3,584 rows of memory 420 associated with a block of memory,and as 32 rows of memory 430 also associated with the same block ofmemory. The row decoder 410 includes logic circuits to accordinglydecode internal addresses to access the rows of memory 420 and 430, andto access rows of memory 440 as associated with the block of memory andas redundant memory, respectively.

The rows of redundant memory 440 are included in one Section of Group400. The rows of memory 430 are also included in one Section of Group400. The rows of redundant memory 440 and the rows of memory 430 may beincluded in the same Section. In the particular example of FIG. 4 , therows of redundant memory 440 and the rows of memory 430 are included inSection 2. The rows of memory 420 are included in Section 0, Section 1,and a portion of Section 2.

Additionally, the rows of redundant memory 440 may be included in aregion that is between the rows of memory 420 and rows of memory 430.For example, the rows of redundant memory 440 are included in a regionthat is physically disposed between the rows of memory 420 and rows ofmemory 430 and/or addressed as different from the rows of memory 420 and430 (unless an address for a row of defective memory in either rows ofmemory 420 or 430 has been remapped to a redundant row included in therows of redundant memory 440).

In embodiments of the disclosure that include the rows of redundantmemory in one section of memory (e.g., Section 2 of Group 400), any ofthe rows of redundant memory may be accessed by activating a set ofsense amplifiers (e.g., sense amplifiers included in a region betweenSection 1 and Section 2). For embodiments of the disclosure includingsense amplifier threshold voltage compensation, power consumptionrelated to operations for accessing the rows of redundant memory may belimited to the power consumed by the activated set of sense amplifiers(e.g., performing concurrent prime memory and redundant memory senseamplifier threshold voltage compensation). In contrast, in architectureswhere the rows of redundant memory are spread over multiple sections ofmemory, multiple sets of sense amplifiers may need to be activated ifany of the redundant rows are to be accessed. Activating the multiplesets of sense amplifiers may consume considerable power.

In some embodiments of the disclosure, the rows of redundant memory areincluded in more than one section of memory. For example, less than allgroups of memory included in a bank of memory include redundant memory,each group of memory including a plurality of sections of memory.

In some embodiments of the disclosure, a bank of memory includes bothGroups 300 and 400. For example, FIG. 5 is a block diagram of a bank ofmemory 500 according to an embodiment of the disclosure. The bank ofmemory 500 may be included in the banks of memory of memory cell array145 of FIG. 1 , in some embodiments of the disclosure. The bank ofmemory 500 includes groups of memory arranged as previously describedwith reference to FIGS. 3 and 4 .

In the example of FIG. 5 , the bank of memory 500 includes severalgroups of memory. Each of the groups of memory includes a plurality ofsections of memory. At least one of the groups of memory includesredundant memory that may be used to repair defective memory included inthe bank of memory 500. Several of the groups of memory also includememory that are associated with more than one block of memory. Each ofthe sections may include the same number of rows and columns of memoryin some embodiments of the disclosure. In some embodiments of thedisclosure, at least one of the sections of memory may include adifferent number of rows and/or columns of memory.

In the example shown in FIG. 5 , the bank of memory 500 includes 16groups of memory, each including 3 sections of memory. As a result, thebank of memory 500 includes 48 sections of memory. The groups of thebank of memory 500 are referenced as Groups 0-15, with each Groupincluding Sections 0-2.

In some embodiments of the disclosure, each of the Sections includes anon-binary number of rows of memory. In the example shown in FIG. 5 , itis assumed that each of the Sections includes 1,376 rows of memory. As aresult, each Group includes 4,128 rows of memory, and the bank of memory500 includes 66,048 rows of memory.

The rows of memory of the banks of memory are decoded by row decoder510. The row decoder 510 may be included in the row decoder 130 of FIG.1 , in some embodiments of the disclosure. Logic circuits of the rowdecoder 510 decode internal addresses to selectively activate a row orrows of memory corresponding to an address to be accessed (e.g., readoperation, write operation, etc.). Sense amplifiers are included in theregions between the Sections (not shown in FIG. 5 ). The senseamplifiers may have an open digit line architecture in some embodimentsof the disclosure. The digit lines may generally correspond to a columnof memory of the sections of memory.

At least one of the Groups includes rows of memory that are decoded asassociated with a plurality of different blocks of memory. For example,in some embodiments of the disclosure, a Group includes rows of memoryassociated with a block of memory, and also includes rows of memoryassociated with another block of memory. The row decoder 510 decodesaddresses to access the Group(s) to include rows of memory from morethan one block of memory. Additionally, every Group does not includerows of memory that are decoded as rows of redundant memory. Forexample, in some embodiments of the disclosure, the rows of redundantmemory for the bank of memory 500 are included in one of the Groups. Insome embodiments of the disclosure, the rows of redundant memory for thebank of memory 500 are included in one of the Sections. The rows ofredundant memory may be used to repair defective rows of memory of thebank of memory 500.

The rows of memory of the bank of memory 500 may be accessed by the rowdecoder 510 as blocks of memory. In the example of FIG. 5 , the rows ofthe bank of memory 500 are accessed as 16 blocks of memory Block 0through Block 15. Each of the blocks include fewer rows than included ina Group. As previously described, the example bank of memory 500includes 16 Groups, and each Group includes 4,128 rows of memory. Insome embodiments of the disclosure, each Block includes a binary numberof rows of memory. For example, each Block 0-15 of FIG. 5 includes 4,096(4K) rows of prime memory. Fifteen of the Groups include rows of memorythat are associated with a corresponding Block (Groups 0-14) and one ofthe Groups includes rows of memory that are associated with a partialBlock (Group 15). The one Group also includes rows of memory that aredecoded as redundant memory, for example, 512 rows of redundant memory.

In some embodiments of the disclosure, the Groups of the bank of memory500 are arranged similarly to Group 300 of FIG. 3 or Group 400 of FIG. 4. For example, rows of memory of Groups 0-14 of the bank of memory 500may be arranged similarly to Group 300 and rows of memory of Group 15may be arranged similarly to Group 400. Example arrangements for Group 0and Group 15 are shown in FIG. 5 . Rows of memory 525 correspond to rowsof memory 320, rows of memory 530A correspond to rows of memory 330,rows of memory 520 correspond to rows of memory 420, rows of memory 530Bcorrespond to rows of memory 430, and rows of memory 540 correspond torows of memory 440.

Blocks 0-14 include rows of prime memory arranged as rows of memory 525.Block 15 includes rows of prime memory that are arranged as rows ofmemory 520 of Group 15 and further includes rows of memory 530A or 530Bfrom each of the Groups 0-15. For example, as previously described, eachof Blocks 0-14 include 4,096 rows of prime memory from a respectiveGroup 0-14 (e.g., Block 0 includes 4K rows of prime memory of Group 0,Block 1 includes 4K rows of prime memory from Group 1, and so on). Block15 includes 4,096 rows arranged as: 3,584 rows of prime memory 520 fromGroup 15, 32 rows of prime memory 530A from Group 0, 32 rows of primememory 530A from Group 1, 32 rows of prime memory 530A from Group 2, andso on through 32 rows of prime memory 530B from Group 15. That is, Block15 includes 3,584+(32×16)=4,096 rows of prime memory, which is the samenumber of rows of memory as Blocks 0-14.

The addresses for the rows of prime memory of Block 15 may be decoded bythe row decoder 510 according to an address sequence. For example, theaddress sequence may start with the rows of prime memory included in therows of memory 520, and sequence from a last row of prime memory in therows of memory 520 to a first row of prime memory in the rows of memory530 included in Group 0. The address sequence may continue through therows of memory 530 from each of the Groups thereafter, until reaching alast row of prime memory in the rows of memory 530 included in Group 15.In other embodiments of the disclosure, the addresses for the rows ofprime memory of Block 15 may sequence in a different manner.

In the example of FIG. 5 , Group 15 further includes rows of memory thatare decoded as rows of redundant memory. The rows of redundant memoryare disposed between rows of prime memory. For example, the rows ofredundant memory 540 are disposed between the rows of prime memory 520and rows of prime memory 530. In the present example, the rows ofredundant memory 540 include 512 rows of redundant memory. The rows ofredundant memory 540 may be used to replace rows of memory for the bankof memory 500. For example, rows of memory of Blocks 0-15 may bereplaced with rows of redundant memory included in the rows of redundantmemory 540.

In the example of FIG. 5 , the rows of redundant memory are included ina Section of the bank of memory 500. As previously described, includingthe redundant memory for a bank of memory in a section of memory allowsfor any of the rows of redundant memory to be accessed by activating acommon set of sense amplifiers. For embodiments of the disclosureincluding sense amplifier threshold voltage compensation, such anarrangement may be desirable for reducing power consumption incomparison to having rows of redundant memory spread over manysections/groups of memory, which are accessed by activating many sets ofsense amplifiers (e.g., performing concurrent prime memory and redundantmemory sense amplifier threshold voltage compensation).

Some embodiments of the disclosure may include placing all redundantelements in one section of memory while supporting a non-binary numberof WL's per section (e.g., 1,376 WL's per section). Also, the number ofnon-sequential address boundaries and prime to redundant boundaries maybe reduced and/or minimized. Such embodiments of the disclosure alsoallow a global row decode layout to be similar from Group to Group. Thepreviously described embodiments are not intended to limit the scope ofthe disclosure to the particular described embodiments. For example, insome embodiments of the disclosure, a row decoder may decode addressesfor a memory bank to include rows of memory that are partitioned intoother non-binary amounts (e.g., e.g., 1,272 WL's per section).

From the foregoing it will be appreciated that, although specificembodiments of the disclosure have been described herein for purposes ofillustration, various modifications may be made without deviating fromthe spirit and scope of the disclosure. Accordingly, the scope of thedisclosure should not be limited any of the specific embodimentsdescribed herein.

What is claimed is:
 1. An apparatus, comprising: a memory cell arrayincluding a bank of memory divided into a plurality of sections ofmemory; and row decoder configured to decode a first received address toaccess a first block of rows of memory cells that is at least partiallydistributed across a first section and a second section of the pluralityof sections of memory and to decode a second received address to accessa second block of rows of memory cells is that is at least partiallydistributed across the first section and a third section of theplurality of sections of memory.
 2. The apparatus of claim 1, whereinthe first block of rows of memory cells includes rows of memory frommore than two sections of the plurality of sections of memory.
 3. Theapparatus of claim 1, wherein one of the plurality of sections of memoryincludes all redundant rows of memory cells allocated to the bank,wherein the redundant rows of memory are configured to repair defectiverows of the first block of rows of memory cells.
 4. The apparatus ofclaim 3, wherein the one of the plurality of sections of memory thatincludes all of the redundant rows of memory cells is a fourth sectionof the plurality of sections of memory.
 5. The apparatus of claim 3,wherein the one of the plurality of sections of memory that includes allof the redundant rows of memory cells is the first section of theplurality of sections of memory.
 6. The apparatus of claim 3, whereinthe redundant rows of memory cells are disposed between rows of primememory of the one of the plurality of sections of memory.
 7. Theapparatus of claim 1, further comprising: a first set of senseamplifiers coupled to columns of memory included in the first section ofthe plurality of sections of memory associated with the first block ofrows of memory cells and configured to be activated to access rows ofthe first block of rows of memory cells included in the first section;and a second set of sense amplifiers coupled to columns of memoryincluded in the second section of the plurality of sections of memoryassociated with the first block of rows of memory cells and configuredto be activated to access rows of the first block of rows of memorycells included in the second section.
 8. The apparatus of claim 1,wherein the first block of rows of memory cells includes rows of memoryfrom each section of the plurality of sections of memory that includerows of memory for two different blocks of memory.
 9. The apparatus ofclaim 8, wherein a total number of rows for the first block of rows ofmemory cells is equal to a number of rows that may be used as a rows ofredundant memory.
 10. The apparatus of claim 1, wherein the firstsection of memory includes a non-power-of-two number of rows of memory.11. The apparatus of claim 10, wherein each of the first block of rowsof memory cells includes a power-of-two number of rows of memory.
 12. Amethod, comprising: decoding a first address to access a first block ofrows of prime memory of a bank of memory, wherein the first block ofrows of prime memory are distributed across at least first and secondsections of the bank of memory; decoding a second address to access asecond block of rows of prime memory of the bank of the memory, whereinthe second block of rows of prime memory are distributed across at leastthe first and a third section of the bank of memory; and repairing a rowof prime memory of the bank of memory by accessing a row of redundantmemory included in a fourth section of the bank of memory.
 13. Themethod of claim 12, further comprising decoding the first address toaccess the first block of rows of prime memory additionally distributedacross a fifth section of the bank of memory.
 14. The method of claim12, wherein the fourth section of the bank of memory includes allredundant rows memory allocated to the bank.
 15. The method of claim 12,wherein the fourth section of the bank of memory is a same section asthe first section of the bank of memory.
 16. The method of claim 12,further comprising decoding a third address to access a third block ofrows of prime memory of the bank of the memory, wherein the third blockof rows of prime memory are distributed across at least the fourthsection of the bank of memory.
 17. The method of claim 12, furthercomprising: activating a first set of sense amplifiers coupled tocolumns of memory included in the first section of the plurality ofsections of memory associated with the first block of rows of primememory to access rows of the first block of rows of prime memoryincluded in the first section; and activating a second set of senseamplifiers coupled to columns of memory included in the second sectionof the plurality of sections of memory associated with the first blockof rows of prime memory to access rows of the first block of rows ofprime memory included in the second section.
 18. The method of claim 12,further comprising decoding the first address to access the first blockof rows of prime memory additionally distributed across rows of memoryfrom each section of the bank of memory.
 19. The method of claim 12,wherein the first section of the bank of memory includes anon-power-of-two number of rows of memory.
 20. The method of claim 18wherein the first block of rows of prime memory includes a binary numberof rows of memory.